Insulated metal printed circuit board
US10638604B1 · kind B1 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2019 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Jun 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) includes a first aluminum layer, having a first thickness, electrically insulated with a coating of alumina applied to a surface of the first aluminum layer; a second aluminum layer, having a second thickness that is different than the first thickness, insulated with a coating of alumina applied to a surface of the second aluminum layer; and a conductive layer bonded to the coating of alumina on the first aluminum layer, the coating of alumina on the second aluminum layer, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.