Compliant micro latch for high-speed signal sub-slot pluggable modules
US10638631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Sep 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1417
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A module includes a physical form factor with one or more openings in a faceplate for receiving a corresponding sub-slot module; module high-speed connectors configured to mate with high-speed connectors in the corresponding sub-slot module; and one or more micro latches for each of the one or more openings to engage a compliant faceplate insert on the corresponding sub-slot module, wherein a single micro latch is utilized to engage a single sub-slot module to provide built-in physical compliancy with a biasing force sufficient to engage the high-speed connectors with the module high-speed connectors. Each of the one or more micro latches includes a latching pin which engages an integrated channel in the compliant faceplate insert on the corresponding sub-slot module and which engages an end of the integrated channel to apply a force to a spring on the compliant faceplate insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.