Method and apparatus for locating a preform on a mold
US10640304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2015 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | May 7, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B2225/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus for locating a preform on a mold includes a preform handling tool and a force sensor coupled to the preform handling tool such that the force sensor is capable of sensing forces applied to the preform during handling of the preform by the preform handling tool. The apparatus includes a control device that is arranged and operable to move the preform handling tool relative to the mold. A method of locating the preform on the mold includes picking up the preform using the preform handling tool and placing the preform in a vicinity of the mold. Positions on the mold are mapped with an edge of the preform with the aid of the force sensor. The preform is paced on the mold according to the mapped positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.