Method and structure of attachment layer for reducing stress transmission to attached MEMS die
US10640374B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Feb 15, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/035
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget−Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.