Bond strength testing systems and methods and compression wave producing devices for use therein
US10641742B2 · kind B2 · utility
0Cited by
8References
53Claims
0Family size
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Key dates
| Filing date | Dec 4, 2017 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A nondestructive bond strength testing method, including: coupling an expendable device to a structure under test, the expendable device including a patterned planar array of exploding bridge wires; simultaneously vaporizing the patterned planar array of exploding bridge wires by applying a pulse of electrical energy to the patterned planar array of exploding bridge wires; and sensing an initial disbonding signature of the structure under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.