Electronic devices with cooling systems
US10642327B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Jul 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0054
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may be provided with a housing surrounding an interior portion of the electronic device. The housing may have one or more layers of material such as fabric layers, polymer layers, and metal layers. An outer fabric layer may have openings between adjacent strands of material such as openings between adjacent warp and weft strands. An inner housing layer such as a layer of plastic or metal may have openings that define airflow entrance and exit ports. The outer fabric layer may overlap the openings of the airflow entrance and exit ports. A fan may draw cooling air into the interior through the airflow entrance port and may expel air through the airflow exit port. An airflow controller in the interior may be controlled by control circuitry based on measurements from temperature sensors. The airflow controller may steer airflow to cool appropriate electronic components in the interior.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.