Position and magnetic field sensors
US10642400B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 27, 2017 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Feb 20, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/03547
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods which provide a semiconductor with thin metallic film deposition sensor configuration are described. Thin metallic film semiconductor sensors of embodiments may be utilized in determining various impingements upon the sensor surface, such as from objects touching, hovering near, or light sources illuminating a sensor surface. Embodiments of a thin metallic film deposition semiconductor sensor provide a non-resistive, non-capacitive sensor configuration operable for determining position of various objects, including both electrically conductive objects and non-electrically conductive objects. A semiconductor with thin metallic film sensor of embodiments may additionally or alternatively provide a magnetic field sensor configuration operable for determining magnitude and/or direction with respect to a magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.