Apparatus and mechanisms for reducing warpage and increasing surface mount technology yields in high performance integrated circuit packages
US10643913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Jun 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stiffener apparatus for reducing warpage of an integrated circuit package during heating and cooling are provided. The stiffener apparatus includes an IC substrate configured to receive an IC die on a top side of the IC substrate. The stiffener apparatus includes a primary stiffener ring adhered to the top side of the IC substrate and defining an opening in a region of the IC die such that the primary stiffener ring surrounds the region of the IC die. The primary stiffener ring defines a plurality of grooves. The stiffener apparatus includes a secondary stiffener ring having a plurality of catches configured to engage with the plurality of grooves to removably attach the secondary stiffener ring to the primary stiffener ring on a side of the primary stiffener ring opposite the IC substrate. A method of using a stiffener apparatus during a manufacturing operation is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.