Semiconductor chip, electronic device including the same, and method of connecting the semiconductor chip to the electronic device
US10643931B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2017 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Aug 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.