Substrate-less waveguide active circuit module
US10643961B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Dec 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1423
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes an enclosure cover; a chip carrier attachable to and removable from the enclosure cover; and a ridge gap waveguide (RGW) cover. The chip carrier includes at least two cavities disposed on one surface and located on opposite sides, and each cavity has a slot extending to an opposite surface of the chip carrier. The RGW cover includes a plurality of ridges and a plurality of pillars disposed on one surface. The enclosure cover and the RGW cover are configured to connect to each other with the chip carrier located therebetween, and the opposite surface of the chip carrier faces the one surface of the RGW cover when the enclosure cover and the RGW cover are connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.