Patent · US Active

Surface treatment method of glass substrate having pit on surface thereof, production method of array substrate, and array substrate

US10644033B2 · kind B2 · utility

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1References

11Claims

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Assignees

Inventors

Donghui Zhang · Beijing, CN
Hao-Hui Yin · Beijing, CN
Chuan Chen · Beijing, CN
Xiaoye Ma · Beijing, CN

Key dates

Filing date	Sep 12, 2018
Grant date	May 5, 2020
Priority date	—
Expiry date	Sep 12, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10D86/411
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

There is provided a surface treatment method of a glass substrate having a pit on a surface thereof, a production method of an array substrate comprising this method, and an array substrate. The method includes: forming a layer of SiO2 sol at least at a side wall of the pit; and drying the layer of SiO2 sol to form a smoothening layer so as to smoothen an upper edge and a lower edge of the side wall of the pit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.