Manufacturing method of light emitting diode device and light emitting diode device having light emitting units with each light emitting unit including second sub light emitting unit in tandem with first sub light emitting unit
US10644195B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 15, 2017 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Nov 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a light emitting diode device and a light emitting diode device are provided. The manufacturing method of the light emitting diode device includes: forming a light emitting lamination layer on a base substrate, the light emitting lamination layer including a first semiconductor layer, a first light emitting layer, a second semiconductor layer, a second light emitting layer and a third semiconductor layer sequentially formed on the base substrate; dividing the light emitting lamination layer to form a plurality of light emitting units spaced from each other, each light emitting unit including a first area and a second area spaced from each other; and removing the third semiconductor layer and the second light emitting layer in the first area to form a first sub light emitting unit, and the second area being used for forming a second sub light emitting unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.