Reduction of surface recombination losses in micro-LEDs
US10644196B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Mar 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/812
Abstract
Disclosed herein are systems and methods for reducing surface recombination losses in micro-LEDs. In some embodiments, a method includes reducing a lateral carrier diffusion in an outer region of a semiconductor layer by implanting ions in the outer region of the semiconductor layer. The semiconductor layer includes an active light emitting layer. An outcoupling surface of the semiconductor layer has a diameter of less than 10 μm. The outer region of the semiconductor layer extends from an outer surface of the semiconductor layer to a central region of the semiconductor layer that is shaded by a mask during the implanting of the ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.