High precision, high resolution collimating shadow mask and method for fabricating a micro-display
US10644239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2015 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Nov 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The method for producing an OLED micro-display on a silicon wafer uses a collimating shadow mask formed on a silicon substrate. The mask is fabricated by depositing a material layer on the front side and on the back side of the substrate and etching a portion of the layer on the back side of the substrate to a reduced thickness of at least 20 microns. At least one opening is created in the etched portion of the substrate. The substrate beneath the opening is removed to create the mask. The mask is situated at a location spaced from the surface of the silicon wafer and exposed to a linear evaporation source. Organic layers are then deposited on the silicon wafer in a location aligned with the mask opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.