Multilayer encapsulation, method for encapsulating and optoelectronic component

US10644262B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Sebastian Wittmann · Regensburg, DE
• Arne Fleißner · Regensburg, DE
• Erwin Lang · Regensburg, DE

Key dates

• Filing date: Mar 29, 2017
• Grant date: May 5, 2020
• Expiry date: Mar 29, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K2102/351

Abstract

A multilayer encapsulation, a method for encapsulating and an optoelectronic component are disclosed. In an embodiment the multilayer encapsulation includes a layer sequence having at least one barrier layer and at least one planarization layer. The barrier layer and the planarization layer together have a lower water permeability than the barrier layer.