Wireless module, printed circuit board, and method
US10644388B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Nov 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The wireless module according to an aspect of the present invention includes a board, a wireless communication chip that at least transmits or receives a high-frequency signal, an insulator, a conductive film, a feed line, first to third conductor patterns, and first and second vias. The chip, the feed line, and the first and second patterns are located on a first wiring layer of the board. The third pattern is at a ground potential and is located on a second wiring layer of the board. The insulator encapsulates the chip. The film covers at least a part of a side surface of the insulator. The feed line electrically connects the chip and the film. The first and second patterns are in contact with the film. The first via connects the first pattern and the third pattern. The second via electrically connects the second pattern and the third pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.