Optical component packaging structure, optical component, optical module, and related apparatus and system
US10644481B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Aug 24, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4278
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical component packaging structure includes a base, a sealing cover, and a cooler. The base includes a mounting surface and a back surface that faces a direction opposite to that faced by the mounting surface. The cooler includes a cooling plate, a heat dissipation plate disposed opposite to the cooling plate, and a conductive connection body connecting the cooling plate and the heat dissipation plate. The cooling plate includes a cooling surface. The cooler is partially built in the base. The cooling plate faces a direction the same as the mounting surface. The sealing cover covers the mounting surface, and the sealing cover and the mounting surface form a sealing cavity. The cooling surface is located inside the sealing cavity. The heat dissipation plate protrudes from the back surface and is sealedly connected to the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.