Patent · US Active

Soft, multilayered electronics for wearable devices and methods to produce the same

US10645803B2 · kind B2 · utility

3Cited by

0References

9Claims

0Family size

Assignee

CARNEGIE MELLON UNIVERSITY · US

Inventors

Carmel Majidi · Berkeley, US
Michael D. Bartlett · Ames, US
Eric Markvicka · Brush, US

Key dates

Filing date	Sep 12, 2018
Grant date	May 5, 2020
Priority date	—
Expiry date	Sep 12, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/166
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

Disclosed herein is an efficient fabrication approach to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.