System and methods for additive manufacturing of electromechanical assemblies
US10645812B2 · kind B2 · utility
1Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2015 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Sep 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.