Multi-part device and method for manufacturing this multi-part device
US10645833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2016 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Aug 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device includes a joining partner, which protrudes at a submersion depth into a recess filled at least partially with a fixing element in a substrate surface of a substrate. A compensating element is situated between the joining partner and the fixing element. The compensating element is situated at least partially in the fixing element within the submersion depth of the joining partner. Accordingly, the compensating element is in contact with the joining partner and with the fixing element. In this way, an expansion change or a movement of the fixing element, of the substrate or of the joining partner may be compensated for by a compression or elongation of the compensating element. A crack formation may be avoided or its effect may be minimized by the sealing function.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.