Active electronically steered array with waveguide manifold thermocoupled to ICS as a heatsink
US10645840B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2019 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Feb 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q3/36
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.