Forced flow cooling temperature control method, system, and apparatus
US10645845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Jan 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20636
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.