Patent · US Active

Thermally conductive composite material

US10647094B2 · kind B2 · utility

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6Claims
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Key dates

Filing dateMar 20, 2018
Grant dateMay 12, 2020
Priority date
Expiry dateAug 9, 2038

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K2201/005
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

There is provided a thermally conductive composite material obtained by dispersing a thermally conductive filler in a matrix. The thermally conductive filler is a mixture including boron nitride particles with an average particle size of 10 μm to 100 μm and aluminum nitride particles with an average particle size that is 1/100 to ½ of the average particle size of the boron nitride particles, a content of the boron nitride particles is 60 volume % to 90 volume % with respect to a total amount of the boron nitride particles and the aluminum nitride particles, a content of the thermally conductive filler is 80 volume % to 95 volume % with respect to a total amount of the composite material, and a porosity of the composite material is 10 volume % or less.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.