System and method for removal of a layer
US10647102B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2017 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jul 11, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2305/076
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system includes a gripper device to grasp a disposable proxy. The gripper device is moveable to position a pressure sensitive adhesive in contact with the disposable proxy and apply a pressure force to adhere the pressure sensitive adhesive to the disposable proxy. The gripper device is moveable to position the pressure sensitive adhesive in contact with an edge portion of a first layer of a plurality of layers and apply a pressure force to adhere the pressure sensitive adhesive to the edge portion of the first layer. The system further includes a cutting device moveable to apply a cutting force to separate a sacrificial corner portion of the first layer proximate the edge portion of the first layer from a remaining portion of the first layer. The gripper device is movable to peel the remaining portion of the first layer from one or more remaining layers of the plurality of layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.