Multilayer structure, method for producing same, packaging material and product including same, and protective sheet for electronic device
US10647487B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2016 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | May 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a multilayer structure including a base (X), a layer (Y), and a layer (Z), wherein the layer (Y) contains an aluminum-containing compound (A), and the layer (Z) contains an organic phosphorus compound (BO) and a polymer (F) having an ether bond and having no glycosidic bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.