Particulate poly(phenylene ether)-containing varnish composition, composite and laminate prepared therefrom, and method of forming composite
US10647877B2 · kind B2 · utility
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6References
15Claims
0Family size
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Key dates
| Filing date | Sep 24, 2015 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | May 24, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2471/12
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.