Tungsten buff polishing compositions with improved topography
US10647887B2 · kind B2 · utility
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36Claims
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Key dates
| Filing date | Jan 8, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Aug 5, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition comprising a) surface-modified colloidal silica particles, comprising a negatively-charged group on the surface of the particles, wherein the surface-modified colloidal silica particles have a negative charge, a particle size of about 90 nm to about 350 nm, and a zeta potential of about −5 mV to about −35 mV at a pH of about 3, b) an iron compound, c) a stabilizing agent, d) a corrosion inhibitor, and e) an aqueous carrier. The invention also provides a method suitable for polishing a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.