Heat pump system, components thereof and methods of using the same
US10648674B1 · kind B1 · utility
0Cited by
49References
27Claims
0Family size
Inventor
Key dates
| Filing date | Jan 1, 2013 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jun 23, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF24D2220/0207
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat transfer systems employing a heat transfer means (e.g., circulating fluid, thermally conductive material, etc.) to transfer heat from the heat source (e.g., fireplace, wood stove or other heat source) to a remote location of a home, residence, building or other structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.