Mold with cavities for nanoimprint lithography and method of imprinting same
US10649327B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2019 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Mar 30, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2059/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold with cavities for nanoimprint lithography and a method of imprinting the same. The mold is a one-piece structure, including an upper mold and a lower mold which are welded together. The upper mold is evenly provided with a plurality of stepped holes. A plurality of grooves are provided at an upper surface of the lower mold. Both ends of each groove are respectively connected to an external high-pressure water pump and an external vacuum pump via pipelines. An airtight cavity is additionally provided at the interior of the mold to form a negative pressure in the cavity by vacuumizing during the imprint process. In the demolding, a crack is formed at the interface between the mold and the imprint resist by using water pressure and expands to the entire interface for the demolding of the imprinted structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.