Device comprising compressed thermal interface material (TIM) and electromagnetic (EMI) shield comprising flexible portion
US10649503B2 · kind B2 · utility
1Cited by
4References
21Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 29, 2017 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jun 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.