Input device manufacturing method
US10649604B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2019 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Mar 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04112
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An input device manufacturing method includes: a first process in which, in a state in which a sensor film is inserted into a die, the sensor film having a detection area and a non-detection area other than the detection area, the detection area and the non-detection area constituting the sensor, as well as a first surface formed into a curved surface and a second surface positioned opposite to the first surface, a material that includes a synthetic resin having a translucent property is poured into the die to form a resin layer on the same side as the second surface; and a second process in which a decorative film having a decorative area that covers the non-detection area is pasted to the first surface with an adhesive layer intervening between the decorative film and the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.