Additive deposition low temperature curable magnetic interconnecting layer for power components integration
US10650957B1 · kind B1 · utility
0Cited by
4References
23Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 31, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.