Light-emitting element wafer, light emitting element, electronic apparatus, and method of producing light-emitting element wafer
US10651232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Mar 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
Abstract
A light-emitting element wafer including a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.