Patent · US Active

Powder metallurgical molding and method of producing same

US10651480B2 · kind B2 · utility

0Cited by

10References

18Claims

0Family size

Assignee

Plansee SE · AT

Inventors

Marco Brandner · Pfronten, DE
Michael O'Sullivan · Reutte, AT
Thomas Leiter · Peoria, US
Oliver Hirsch · Zermatt, CH
Wolfgang Kraussler · Murau, AT

Key dates

Filing date	Mar 1, 2016
Grant date	May 12, 2020
Priority date	—
Expiry date	Aug 9, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E60/50
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A powder metallurgical molding forms an interconnector or an end plate for an electrochemical cell. The molding has a chromium content of at least 80% by weight, a basic shape of a plate and one or more flow fields with structuring formed on one or both of the main faces of the molding. A ratio of a maximum diameter Dmax of the molding, measured along the main face, to a minimum thickness dmin of a core region of the molding which extends along the flow field or fields and is not affected by the structuring lies in a range of 140≤Dmax/dmin≤350.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.