Package integrated waveguide
US10651541B1 · kind B1 · utility
7Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2019 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Feb 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a packaged semiconductor device including forming an assembly by coupling a semiconductor die and an antenna by way of a substrate, contacting with a conformal structure at least a portion of a first surface of the antenna, and encapsulating the assembly with an encapsulant such that the at least a portion of the first surface of the antenna contacted by the conformal structure is not encapsulated with the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.