Patent · US Active

Bonding jumper system

US10651572B1 · kind B1 · utility

1Cited by
18References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 10, 2019
Grant dateMay 12, 2020
Priority date
Expiry dateJun 10, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R4/34
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An embodiment of a bonding jumper systems can include one bonding jumper comprising an electroconductive material. The bonding jumper can be a member comprising an inlet end and an outlet end. The at least one bonding juniper can be configured to be mechanically coupled to a water meter body. The water meter can comprise an inlet and outlet that both comprise an electroconductive fitting. The inlet end is mechanically coupled to the inlet to initiate an electrical coupling and the outlet end is mechanically coupled to the outlet to complete the electrical coupling. The bonding jumper system can further include a cover configured to encapsulate the meter body and the at least one bonding jumper.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.