Seal for an earthing bond
US10651592B2 · kind B2 · utility
1Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R11/16
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention relates to an earthing bond seal for sealing between a flanged bush of an earthing bond and a substrate with which the flanged bush is to form an electrical connection, the seal comprising: an upper surface for engagement with the flange of the bush; a lower surface for engagement with the substrate; and an opening extending between the upper and lower surfaces, wherein the upper surface is provided with a first recess configured to receive the flange of the bush.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.