Transceiver hot swap contact structure
US10651598B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Aug 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.