Thermal flow assembly including integrated fan
US10653034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jul 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/467
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.