Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers

US10653332B2 · kind B2 · utility

Assignee

• MC10, INC. · US

Inventors

• Bryan McGrane · Denver, US
• Milan Raj · Natick, US
• Pinghung Wei · San Francisco, US
• Briana Morey · Somerville, US
• Roozbeh Ghaffari · Cambridge, US
• Monica Lin · Oakland, US
• Jeffrey Model · Cambridge, US
• Xianyan Wang · South San Francisco, US
• Bryan D. Keen · Somerville, US
• Stephen Lee · Taipei, TW

Key dates

• Filing date: Jul 12, 2016
• Grant date: May 19, 2020
• Expiry date: Oct 28, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1327
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical energy to the contact pads of the flexible printed circuit board.