Ultrathin barrier laminates and devices
US10654251B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2016 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Aug 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/80
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.