Valved micronozzle array for high temperature MEMS application
US10654272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2019 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/441
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the disclosed subject matter provide a micronozzle array formed from monolithic silicon. The micronozzle array may have a plurality of nozzles, where each nozzle of the plurality of nozzles including an integrated plug valve that allows flow from the nozzle to be attenuated separately from each other nozzle of the plurality of nozzles. Each of the plurality of nozzles may include a microchannel, formed from the monolithic silicon, having a first channel portion and a second channel portion, where the first channel portion is narrower than the second channel portion, and where the first channel portion forms an aperture of the nozzle that is configured to eject vapor from the microchannel. Each of the plurality of nozzles may include a stem, formed from the monolithic silicon that includes the integrated plug valve is suspended in the microchannel to attenuate the flow from the nozzle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.