Resin blend for melting process
US10655003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2011 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Mar 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin blend for a melting process, to a method for manufacturing a resin molding using same, and to a resin molding obtained thereby, the resin blend comprising a first resin and a second resin, wherein the second resin includes a polymer resin having at least one organic functional group selected from the group consisting of an alkyl group having 2 to 20 carbon atoms, an alicyclic ring having 5 to 40 carbon atoms and an aromatic ring having 6 to 40 carbon atoms, and has, with the first resin, a melt viscosity difference of 0.1 to 3,000 Pa*s at a shear rate of 100 to 1,000 s−1 and a processing temperature of the resin mixture, and a glass transition temperature (Tg) difference of 10° C. to 150° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.