Siloxane resin compositions
US10655014B2 · kind B2 · utility
0Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2016 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Feb 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Addition curable silicone resin compositions have excellent processing characteristics, and can be used to encapsulate electrical and electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.