Oxidizing fluid for the chemical-mechanical polishing of ceramic materials
US10655035B2 · kind B2 · utility
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3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | May 24, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure is directed to a fluid composition that can be used in chemical-mechanical polishing processes of inorganic material. The fluid composition can include at least one oxidizing agent and a multivalent cation component. Using the fluid composition during a chemical-mechanical polishing process can facilitate a relatively defect free material surface after polishing while achieving a suitable material removal rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.