Method and apparatus for retrieving valuable metals step by step from waste printed circuit board particles
US10655198B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 30, 2017 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jan 24, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method and apparatus for step-by-step retrieving valuable metals from waste printed circuit board particles. Many kinds of metals, most existing in form of elementary substance or alloy, are contained in the waste printed circuit boards. Molten metals are separated selectively by supergravity separation at different temperatures to achieve the step-by-step recovery. Tin-based alloys, lead-based alloy, zinc aluminum alloy, crude copper and precious-metal-enriched residues with different metal contents are separated out and collected on the condition of different temperatures (T=200˜300° C., 330˜430° C., 700˜900° C., 1100˜1300° C.) and controlling the gravity coefficient (G=50˜1000) and separation time (t=2˜20 min) etc. Different metals or alloys can be separated quickly and efficiently and the residue concentration of precious metals can be obtained. The process is simple and low cost to provide an efficient way to recovery the enrichment of valuable metals from electronic wastes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.