Patent · US Active

Stable electroless copper plating compositions and methods for electroless plating copper on substrates

US10655227B2 · kind B2 · utility

0Cited by

13References

9Claims

0Family size

Assignee

Rohm and Haas Electronic Materials LLC · US

Inventors

Alejo M. Lifschitz Arribio · Waltham, US
Donald E. Cleary · Littleton, US

Key dates

Filing date	Jul 13, 2018
Grant date	May 19, 2020
Priority date	—
Expiry date	Jul 13, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C18/405
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Select carboxymethyl-thio compounds are added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.