Flooring mat with entangled filament structure
US10655341B2 · kind B2 · utility
1Cited by
13References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 14, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jun 14, 2038 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04B1/64
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A flooring mat that includes a first layer that includes a vapor barrier, a second layer that includes a textile pad, and a third layer having an entangled filament structure. The second layer is disposed between the first layer and the third layer. The flooring mat may be provided between a subfloor and a surface layer of a flooring structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.