Curved touch module structure and method for laminating the same
US10656736B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jun 7, 2018 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jul 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A curved touch module structure and a method for laminating the same, which are the theremoplastic technologies, are used to solve the problem with wrinkles at stress-accumulated positions easily caused by a laminated material during a process of laminating a curved surface. The internal curved surface of an appearance-protecting layer has a planar structure whose position corresponds to the bonding area of a touch element layer. When the touch element layer is theremoplastically laminated to the curved surface of the appearance-protecting layer, the first bonding pads of the bonding area are formed on the planar structure. As a result, when a rear-end process for hot pressing and bonding is performed, a bonding platform needs to be designed according to the shape and curvature of products without modifying the other existing elements, thereby increasing the fabrication yield and reducing the production cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.