Touch panel and manufacturing method thereof
US10656738B1 · kind B1 · utility
Assignees
Inventor
Key dates
| Filing date | Jan 7, 2019 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Jan 7, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04106
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch panel includes at least one touch sensing layer, a first metal layer, a second metal layer, a through hole, a metal film, and a conductive structure. The first and second metal layers are respectively located above and below the touch sensing layer. The through hole penetrates through the first metal layer, the touch sensing layer, and the second metal layer. The through hole has a first opening and a second opening. The metal film is on a bottom surface of the second metal layer and covers the second opening of the through hole. The conductive structure is located on the metal film and in the through hole. An end of the conductive structure adjacent to the first opening has a microstructure. The microstructure extends to a top surface of the first metal layer and surrounds the first opening of the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.